GDM300晶圓研磨（Wafer Grinding）衡鵬
—采用全自動系統，從后磨到貼裝的連續過程

GDM300晶圓研磨（Wafer Grinding）特長：
·The process from back grinding to wafer mounting continuously by fully automatic system, Which enable to grind till 25um thickness.
采用全自動系統，從后磨到貼裝的連續過程，可研磨至25um厚度。
·With 2 head polishing stage, throughput is almost double compared with 1 polish head system.
2個磨頭階段，產量幾乎是1個磨頭系統的兩倍。

·Built in edge trimming system is available as an option for thin wafer process.
內置修邊系統可作為薄型晶圓加工的選擇。

·Dual index system, which polishing stage and grinding stage is completely separated, satisfy the cleanness required for TSV and MEMS process.
雙指標體系，拋光階段和研磨階段*分離，滿足TSV和MEMS工藝所需的清潔。
·Less than Ra1A ultra luminance, ultra mirror surface is possible.
超亮度小于Ra1A，可超鏡面。

GDM300晶圓研磨（Wafer Grinding）相關產品：
衡鵬供應
GNX200BP晶圓研磨/晶圓減薄/晶圓拋光/晶圓背拋/Wafer Grinding