產品概述：
樹脂結合劑整體型切割砂輪主要用于半導體封裝材料、光學玻璃、石英玻璃、陶瓷材料等精密元器件的精密切割與開槽。
Product overview
Resin bond dicing blades without steel core is mainly used for precision cutting and slotting for semiconductor, optical glass, quartz glass,ceramics and son on.
主要特點：
結合劑富有彈性，可提高加工表面質量；切割鋒利可有效減少砂輪修整次數或無需修整；切割精度高，適用范圍廣泛；尺寸規格多樣，供貨周期短。
Main features
Sharpness cutting and elastic bond can improve the surface quality.
High precision, less dress or no need to dress.
Widely used, variety specifications, short delivery time.
主要應用領域：
ZS001 系列適用于半導體封裝材料（KFN、DFN 等）的加工，有效的防止縱向和橫向拉毛，加工效率高，使用壽命長；
ZS002 系列適用于光學玻璃的加工，有效的防止崩口和背崩現象，提高成品率；
ZS003 系列適用于石英玻璃的加工，有效的防止崩口，加工效率高，產品光潔度好；
ZS004 系列適用于陶瓷材料的加工，有效防止崩口和切碎現象，提高加工品質；
其他系列對水晶、磁性材料、硬質合金、各種高硬度難加工金屬材料的開槽或切斷均具有良好的切割品質。
Application
ZS001 series is suitable for semiconductor component(KFN、DFN), which can avoid burrs, and improve efficiency and life.
ZS002 series is suitable for optical glass, which can avoid chip and improve yield.
ZS003 series is suitable for quartz glass, which can avoid chips and improve efficiency, and finish of product.
ZS004 series is suitable for ceramics, which can avoid chips and cracks, and improve the processing quality.
Other series are suitable for slotting and cutting of crystal, magnetic materials, carbide and some other
difficult to cut metal materials with excellent cutting quality.
供參考的典型規格及精度
Model specification and the precision for reference(mm)
